
77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups

Automotive projects often need reliable materials, traceability and careful process control. PCB manufacturing for automotive use is IATF 16949-certified for boards built to customer design. This describes typical requirements and is not a customer reference.
| Positioning | Automotive / Radar |
|---|---|
| Typical applications | ADAS, 77/79GHz Radar, BMS, In-Vehicle Cameras |
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
Typical requirements from the ShinePCB application capability sheet. Each project is reviewed against its own drawing and specification.
| End product / typical modules | Applicable PCB types | Key processes | Material direction | Engineering focus |
|---|---|---|---|---|
| ADAS / domain controllers — SoC, high-speed memory, camera interfaces, Ethernet, power | High-layer-count, HDI, high-speed, rigid-flex | Any-layer / high-order HDI; impedance; back drilling; POFV; fine lines | Automotive-grade high-Tg FR-4; low-loss; CAF-resistant | Thermal cycling; vibration; traceability; signal integrity |
| 77/79 GHz mmWave radar — RF antenna board, RF front end, digital processing | High-frequency, hybrid high-frequency, HDI | Hybrid lamination; fine lines; impedance; layer registration | Rogers / Isola / Taconic microwave materials; low-loss FR-4 | Dk/Df consistency; copper roughness; etch compensation; warpage |
| BMS / cell contact systems — main control, sampling, balancing, HV interface | Heavy copper, high-layer-count, FPC, rigid-flex | Heavy copper; high current; high-voltage spacing; long boards; press-fit holes | High-Tg / CAF-resistant FR-4; FPC; high thermal conductivity | High-voltage safety; temperature rise; insulation; traceability |
| In-vehicle cameras / cockpit — camera module, display control, SerDes | HDI, FPC, rigid-flex, high-speed multilayer | Fine lines; laser vias; impedance; rigid-flex; via-in-pad; thin boards | Thin high-Tg FR-4; low-loss; FPC materials | Miniaturization; bending; high-speed links; cleanliness |
Application descriptions show typical board requirements. They are not customer references, and end-product standards remain the responsibility of the product owner. IATF 16949 scope: manufacturing of printed circuit boards (clause 8.3 product design excluded).
Board constructions from the ShinePCB company presentation — not customer references.





Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
PCB manufacturing is IATF 16949-certified for boards built to customer design. Scope details are provided in formal documents.
Documentation requirements are clarified before quotation.